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| NL27WZU04 Dual Unbuffered Inverter The NL27WZU04 is a high performance dual unbuffered inverter operating from a 1.65 to 5.5 V supply. These devices are well suited for use as oscillators, pulse shapers, and in many other applications requiring a high-input impedance amplifier. For digital applications, the NL27WZ04 is recommended. Features http://onsemi.com * * * * * * * Pb-Free Package is Available Designed for 1.65 V to 5.5 V VCC Operation Unbuffered for Crystal Oscillator and Analog Applications LVCMOS Compatible Source/Sink $16 mA @ 4.5 V VCC Near Zero Static Supply Current Substantially Reduces System Power Requirements Chip Complexity: FET = 72; Equivalent Gate = 18 MARKING DIAGRAMS SC-88 / SOT-363/SC-70 DF SUFFIX CASE 419B M6d Pin 1 d = Date Code IN A1 1 6 OUT Y1 TSOP-6/SOT-23/SC-59 DT SUFFIX CASE 318G M6d GND 2 5 VCC Pin 1 d = Date Code IN A2 3 4 OUT Y2 PIN ASSIGNMENT 1 IN A1 GND IN A2 OUT Y2 VCC OUT Y1 Figure 1. Pinout (Top View) 2 3 4 5 IN A1 IN A2 1 1 OUT Y1 OUT Y2 6 ORDERING INFORMATION Figure 2. Logic Symbol See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. FUNCTION TABLE A Input L H Y Output H L (c) Semiconductor Components Industries, LLC, 2004 1 September, 2004 - Rev. 3 Publication Order Number: NL27WZU04/D NL27WZU04 MAXIMUM RATINGS Symbol VCC VI VO IIK IOK IO ICC IGND TSTG PD qJA TL TJ VESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Power Dissipation in Still Air Thermal Resistance Lead Temperature, 1 mm from case for 10 s Junction Temperature under Bias ESD Withstand Voltage Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) Above VCC and Below GND at 85C (Note 4) SC-88, TSOP-6 SC-88, TSOP-6 VI < GND VO < GND VO > VCC Characteristics Value *0.5 to )7.0 *0.5 VI VCC *0.5 to 7.0 *50 *50 +50 50 100 100 *65 to )150 200 333 260 )150 > 2000 > 200 N/A 500 Unit V V V mA mA mA mA mA C mW C/W C C V ILatchUp LatchUp Performance mA Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Tested to EIA/JESD22-A114-A. 2. Tested to EIA/JESD22-A115-A. 3. Tested to JESD22-C101-A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC VI VO TA Dt/DV Supply Voltage Input Voltage Output Voltage Operating Free-Air Temperature Input Transition Rise or Fall Rate VCC = 2.5 V 0.2 V VCC = 3.0 V 0.3 V VCC = 5.0 V 0.5 V (High or LOW State) Parameter Operating Data Retention Only Min 1.65 1.5 0 0 *40 0 0 0 Max 5.5 5.5 5.5 VCC )85 20 10 5 Unit V V V C ns/V http://onsemi.com 2 NL27WZU04 DC ELECTRICAL CHARACTERISTICS VCC (V) 1.65 to 1.85 2.3 to 5.5 VIL VOH Low-Level Input Voltage g High-Level Output Voltage VIN = VIL VIN = GND IOH = -100 mA IOH = -3 mA IOH = -4 mA IOH = -6 mA IOH = -8 mA IOH = -12 mA IOH = -16 mA VOL Low-Level Output Voltage VIN = VIH VIN = VCC IOL = 100 mA IOL = 3 mA IOL = 4 mA IOL = 6 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IIN ICC Input Leakage Current Maximum Quiescent Supply Current VIN = VCC or GND VIN = VCC or GND 1.65 to 1.85 2.3 to 5.5 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 5.5 1.65 to 5.5 0.08 0.12 0.20 0.24 0.26 0.31 VCC-0.1 1.29 1.9 2.2 2.4 2.3 3.8 1.52 2.1 2.3 2.6 2.5 4.2 0.1 0.24 0.3 0.4 0.4 0.55 0.55 $0.1 1.0 TA = 25C Min 0.85 VCC 0.8 VCC 0.15 VCC 0.2 VCC VCC-0.1 1.29 1.9 2.2 2.4 2.3 3.8 0.1 0.24 0.3 0.4 0.4 0.55 0.55 $1.0 10 mA mA V Typ Max *40C TA 85C Min 0.85 VCC 0.8 VCC 0.15 VCC 0.2 VCC V V Max Unit V Symbol VIH Parameter High-Level Input Voltage g g Condition II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I I II I I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I I II I I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I II I I II I I III I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W TA = 25C Typ 5.5 3.3 2.7 4.0 2.2 3.4 *40C TA 85C Min 1.5 1.2 0.8 1.2 0.5 0.8 Max 11.0 6.3 4.5 7.0 3.6 6.2 Symbol tPLH tPHL Parameter Condition VCC (V) Min 1.5 1.2 0.8 1.2 0.5 0.8 Max 1.8 5.7 4.1 6.4 3.3 5.6 Unit ns Propagation Delay Input A to Y (Fi d (Figure 3 and 4) RL = 1 MW, CL = 50 pF 1.8$0.15 2.5$0.2 3.3$0.3 RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF 5.0$0.5 RL = 500 W, CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol CIN COUT CPD Parameter Condition Typical 7 8 25 Unit pF pF pF Input Capacitance Output Capacitance Power Dissipation Capacitance (Note 5) VCC = 5.5 V, VI = 0 V or VCC VCC = 5.5 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL27WZU04 A or B 50% VCC GND tPLH tPHL PULSE GENERATOR RT 50% VCC VCC DUT CL RL Y PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns CL = 50 pF or equivalent (includes jig and probe capacitance) RL = R1 = 500 W or equivalent RT = ZOUT of pulse generator (typically 50 W) Figure 3. Switching Waveforms Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Logic Circuit Indicator No. of Gates per Package Temp Range Identifier Tape & Reel Suffix Package Type (Name/SOT#/ Common Name) SC-88 / SOT-363 / SC-70 SC-88 / SOT-363 / SC-70 (Pb-Free) TSOP-6 / SOT-23 / SC-59 Device Order Number Technology Device Function Package Suffix Tape and Reel Size 178 mm (7") 3000 Unit NL27WZU04DFT2 NL 2 7 WZ U04 DF T2 NL27WZU04DFT2G NL 2 7 WZ U04 DF T2 178 mm (7") 3000 Unit 178 mm (7") 3000 Unit NL27WZU04DTT1 NL 2 7 WZ U04 DT T1 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NL27WZU04 PACKAGE DIMENSIONS SC70-6/SC-88/SOT-363 DF SUFFIX CASE 419B-02 ISSUE U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B-01 OBSOLETE, NEW STANDARD 419B-02. INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --- 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --- 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 A G 6 5 4 S 1 2 3 -B- D 6 PL 0.2 (0.008) M B N M DIM A B C D G H J K N S J C H K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 NL27WZU04 PACKAGE DIMENSIONS SOT23-6/TSOP-6/SC59-6 DT SUFFIX CASE 318G-02 ISSUE M A L 6 5 1 2 4 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS DIM MIN MAX A 2.90 3.10 B 1.30 1.70 C 0.90 1.10 D 0.25 0.50 G 0.85 1.05 H 0.013 0.100 J 0.10 0.26 K 0.20 0.60 L 1.25 1.55 M 0_ 10 _ S 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181 S B D G M 0.05 (0.002) H C K J SOLDERING FOOTPRINT* 2.4 0.094 1.9 0.075 0.95 0.037 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 6 NL27WZU04/D |
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